Wireless Technics headphones to invigorate the music you love

Introducing the EAH-F70N and EAH-F50B

• Faithfully reproduces delicate nuances and dynamic sound

• Delivers powerful bass and spatial ambiance

• High-Res equivalent wireless sound reproduction thanks to LDAC/apt-X HD
  

7th January 2019 – Technics has unveiled two new wireless headphones, the EAH-F70N and EAH-F50B. Both models support LDAC/apt-X HD for wireless, high-res-equivalent^*1 sound reproduction. Backed by high rigidity and high internal damping, the use of a 40-mm dynamic drivers, consisting of composite performance film (CPF) diaphragm and precise air control structure enables the new models to faithfully reproduce the delicate nuances of music and dynamic sound. The EAH-F70 features Technics' original wide-band hybrid active noise-cancelling to allow immersion in music under virtually any environment.

A wireless music experience generating real-life sensations of energy and spatial expansion

40mm dynamic driver with newly developed diaphragm

This diaphragm is consisted with newly developed composite performance film (CPF) laminated with a plurality of special materials for high rigidity and high internal damping. The result is a powerful bass that seems to soar from the bottom depths and a spatial ambience that makes you feel as if you are in a concert hall. To maximise the effects of these characteristics, the shape of the diaphragm has been designed with the utmost attention to detail.

The special bullet-shaped dome has realised improved rigidity. The natural and linear high-frequency characteristics provide a smooth and lustrous sound. The rib edge shape has been optimised through simulation to attain high linearity across the entire input range, from weak to large input. All delicate nuances of music and realistic dynamics are faithfully reproduced.

A precise air control structure,

Detailed simulation and fine tuning were repeated to achieve a precise air control structure that results in an optimal air flow. The two carefully designed ports and original construction create an accurate air flow to bring out the wide-range frequency reproduction capability from the driver.

High-res-equivalent*sound quality even in wireless

The headphones support LDAC™, Qualcomm^® and apt-X™ HD, and offer excellent response and high resolution even in a wireless configuration to reproduce accurate and faithful high-res-equivalent^*1 sound.

*When connected via Bluetooth^®, LDAC supports up to 96 kHz/24 bits and apt-X HD supports up to 48 kHz/24 bits (high-res reproduction when connected by cable).

Noise reduction in a wide-range of scenes

Hybrid active noise cancelling - 3 Modes (EAH-F70 only)

The hybrid noise cancelling system combines two different systems to realise high noise reducing performance. A three-level mode selector allows selection of the noise cancelling effect according to the usage situation.

The hybrid noise cancelling system uses two different systems: the feedforward system which uses a microphone mounted on the outside and the feedback system which uses a microphone located near the driver positioned close to the ear. In addition, the circuit was originally designed to provide improved noise cancelling performance.

Smart & Seamless Operation

Wearing sensor (EAH-F70 only)

When the headphones are removed the music stops. Once put back on, music resumes for comfortable, seamless operation.

Ambient sound enhancer (EAH-F70 only)

This function lets you listen to background sounds, such as announcements made on a train or in an airport by simply touching the outside of the housing, without removing the headphones from your head.

Voice assist activation

This function activates voice assistance, such as Siri in the iPhone. By speaking, you can make a phone call, select a music title to play* in linkage with a music streaming service or check the weather or route guidance.

* When using a music streaming service, it may be necessary to link the voice assistance to the account or subscribe to the flat-rate service.

Stylish design and comfortable fit

3D ball joint mechanism

The ball joint mechanism allows three-dimensional movement of the ear cuff to fit the ear at a comfortable angle. The ear pad is made of soft, low-resilient polyurethane foam.

High-grade materials

The outer parts are made of aluminium. The alumite treatment and spin finish bring out the high-grade ambience of the material. The Technics logo mark is laser-engraved and coloured. Every detail reflects the high-grade design.

Swivel & fold mechanism

The swivel & fold mechanism makes it easy to carry and store the headphones.

3D ear pads

The shape of the ear pads is ergonomically designed and low-resilient polyurethane foam is used inside the pads to ensure a snug fit around the ears. The ear pads offer increased isolation and sound insulating performance as well as extra comfort.

TRADEMARK NOTICE:

The Bluetooth^® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Panasonic Corporation is under license. Other trademarks and trade names are those of their respective owners.

LDAC is a trademark of Sony Corporation.

Qualcomm aptX is a product of Qualcomm Technologies International, Ltd.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries, used with permission. aptX is a trademark of Qualcomm Technologies International, Ltd., registered in the United States and other countries, used with permission.